Flux for Dip Soldering

机译：用于浸焊的助焊剂

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摘要

The purpose of invention is a flux, for the dip-solder method, containing glycerin and diethylamine hydrochloride. To increase flux activity and fluidity at 160 to 240 C and to increase the corrosion resistance of solder fusions, the flux components are taken in the following percentage ratio: glycerin 95 to 97, diethylamine hydrochloride 5 to 3. (Author)

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作者
Ivanova, L. B.; Maksimikhin, B. A.; Nesterova, M. A.;
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年度 1965
页码 p.1-2
总页数 2
原文格式 PDF
正文语种 eng
中图分类
关键词
SOLDERING FLUXES ; PATENTS ; SOLDERING ; ALCOHOLS ; AMINES ; CHLORIDES ; EFFECTIVENESS ; CORROSION INHIBITION ; USSR;

机译：焊接流量;专利;焊接;酒精;胺;氯化物;有效性;腐蚀抑制;苏联;

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专利

1. The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering [J] . Jeong Hwan Lee, Sung Woo Ma, Young Min Kim, Journal of materials science . 2013,第9期

机译：助焊剂变形对无助焊剂中Sn-3.5Ag焊料在Cu基体上的润湿特性和界面反应的影响
2. the 5 essential soldering rules Fit. Clean. Flux. Solder placement.Heat. Get these right and your soldering will be a success every time. [J] . LEXI ERICKSON Lapidary journal . 2011,第2期

机译：5个基本焊接规则合适。清洁。助焊剂焊锡放置热。正确处理这些问题，每次焊接都会成功。
3. Solder alloys and soldering processes for flux-free soldering of difficult-to-wet materials [J] . Frank Hillen, Dagmar Pickart-Castillo, Ino J. Rass, Schweissen & Schneiden . 2000,第8期

机译：焊料合金和焊接工艺，用于难湿材料的无助焊剂焊接
4. SELECTION OF DIP TRANSFER FLUXES AND SOLDER PASTES FOR POP ASSEMBLY [C] . Yan Liu, Pamela Fiacco, Derrick Herron, South East Asia Technical Training Conference on Electronics Assembly Technologies . 2011

机译：选择浸入式助焊剂和焊膏的弹出组件
5. Effects of solder-dipping as a termination re-finishing technique. [D] . Sengupta, Shirsho. 2006

机译：浸锡作为终端修整技术的效果。
6. Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames [O] . Ting Yin, Nan Xiang, Guangxin Wang, 2020

机译：在电路引线框架上制造可焊锡涂层的最佳热浸镀锡工艺程序
7. Thermal decomposition of solder flux activators under simulated wave soldering conditions [O] . Piotrowska Kamila, Jellesen Morten Stendahl, Ambat Rajan 2017

机译：模拟波峰焊条件下助焊剂活化剂的热分解

Flux for Dip Soldering

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