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A PROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZATION OF METAL-FILM RESISTORS

机译:一种基板电阻器,用于金属膜电阻的微型化

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摘要

The pew cylindrical substrate was checked for uniformity of weight and weight-to-volume ratio.nReproducibility of metallizing was verified using the atmospheric technique. Fifteen lots of ten units per lot were metallized and variations within each lot and from lot-to-lot were noted. Some of these units were used later for load life and temperature coefficient of resistance testing.nDevelopment of the new solder terminal was completed and its quality was compared to the epoxy terminal using especially the 90° ratio test.nA method of encapsulation was adopted utilizing a ceramic tube, end caps and an epoxy coating.

著录项

  • 作者

    T. Matley;

  • 作者单位
  • 年度 1965
  • 页码 1-44
  • 总页数 44
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工业技术;
  • 关键词

  • 入库时间 2022-08-29 11:43:07

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