Economical Flat Package for Integrated Circuits

机译：集成电路经济型扁平封装

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The ultrasonic bonding method was extensively re-evaluated after observing in process bond failures. Corrective measures have been instituted and improvement is seen on initial testing.

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年度 1965
页码 p.1-16
总页数 16
原文格式 PDF
正文语种 eng
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关键词
Integrated circuits ; Packaging ; Bonding ; Ultrasonic radiation ; Manufacturing methods ; Costs ; Processing;

机译：集成电路;封装;粘接;超声波辐射;制造方法;成本;加工;

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1. From model to low noise amplifier monolithic microwave integrated circuit: 0.03–2.6 GHz plastic quad-flat no-leads packaged Gallium-Nitride low noise amplifier monolithic microwave integrated circuit [J] . Osmanoglu Sinan, Ozbay Ekmel International journal of numerical modelling . 2021,第5期

机译：从模型到低噪声放大器单片微波集成电路：0.03-2.6 GHz塑料四扁平无铅包装镓 - 氮化物低噪声放大器单片微波集成电路
2. Economical Package Aids Design Of Linear Circuits [J] . Microwaves & Rf . 1999,第13期

机译：线性电路的经济型包装辅助设计
3. Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies [J] . Amelie Hagelauer, Maciej Wojnowski, Klaus Pressel, IEEE microwave magazine . 2018,第1期

机译：集成式系统级封装：扇出晶圆级封装技术中毫米波有源电路和无源器件的异构集成
4. Predictive simulation of CDM events to study effects of package, substrate resistivity and placement of ESD protection circuits on reliability of integrated circuits [C] . Shukla Vrashank, Jack Nathan, Rosenbaum Elyse IEEE International Reliability Physics Symposium . 2010

机译：CDM事件的预测模拟，以研究封装，基板电阻率和ESD保护电路的放置对集成电路可靠性的影响
5. Scalable Package-level Power Management for 2.5D Integrated Circuits [D] . Straube, Kramer Kyle. 2019

机译：用于2.5D集成电路的可扩展包级电源管理
6. Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages [O] . B. K. Tanner, A. N. Danilewsky, R. K. Vijayaraghavan, -1

机译：嵌入集成电路封装的硅芯片翘曲的无损X射线衍射测量
7. Graphene oxide films for advanced ultra-flat optical devices and photonic integrated circuits [O] . David Moss 2020

机译：用于高级超平光学装置和光子集成电路的石墨烯氧化物膜
8. An Economical Flat Package for Integrated Circuits [R] . 1964

机译：集成电路的经济型扁平封装

Economical Flat Package for Integrated Circuits

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