Production Engineering Measure for Multilayer Printed Wiring Board

摘要

The ability to produce Subminiature and Ultraminiature Layered Printed Wiring using the clearance hole method of construction at the rate of 60 units in an 8 hour shift was established. All processes, tooling, material requirements and lead times were evaluated and developed. The testing of Preproduction Samples indicated that they will meet all the requirements of SCL-7503 with the exception of solderability. In addition, similar evaluation was made for Subminiature and Ultraminiature Layered Printed Wiring boards using the plated-through hole method of construction and the Preproduction Samples made by this process have met all the requirements of SCL-7503 specifications. (Author)