Integrated Silicon Device Technology. Volume Xiv. Interconnections and Encapsulation

摘要

The elements of integrated device operations following the completion of all wafer processing are discussed. Specific emphasis is given to the separation of wafers into chips by scribing and breaking operations, to wire bonding and other contacting methods, to both conventional and unconventional packaging, and to the interconnecting of packages. The package interconnection discussion indicates major trends and problem areas and is not a comprehensive discussion of all of the many methods employed. From the generation of integrated device chips to their actual use in systems, procedures are in a continual flux due to their competitive nature and the methods are often derived from nontechnical considerations. This volume is, therefore, more a report on current practices than on the engineering and science of this subject area. (Author)