Research in High-Density Storage Using Electron Beam-Activated Machining Techniques.

摘要

This program is devoted to the preparation and investigation of two novel kinds of electron-beam-addressable storage elements of submicron size and densely packed arrays of these elements; also to the construction of a large-capacity, high-speed, electron-beam-addressable, data-storage system utilizing regular arrays of these elements. One kind of element, called a micro-cap, consists of an isolated microcapacitor at the bottom of a hole in a metal/dielectric/metal film sandwich. The other kind, called a micro-ring, consists of an isolated metal film ring embedded concentrically with a hole in the dielectric of a multilayer metal/dielectric film sandwich.