R and D of the Technologies Required to Design and Fabricate Ultrahigh-Speed Computer Systems

摘要

A research and development program directed toward the development of technologies for high speed computer subsystems is described. Increases in the yield of low power, high speed, high density ECL complex logic arrays, made possible by improved multilevel interconnection technologies, are reported. Multichip high speed LSI subsystems have been assembled by face-down bonding. Computer aid has been incorporated into a system for designing and generating photomasks for complex high speed microcircuits. Results are given for a high speed, high density transistor read only memory. (Author)