Modular and Micromodular Elements and Unified Functional Units of Radio Electronic Equipment (Chapter IX)

摘要

The chapter discusses new and unused trends in construction and the technology of radio electronic equipment such as microminiaturization. Flat and three-dimensional modules, modular construction of blades and devices, equipment based on the application of micromodules of the graduated type, and thin film technology (molectronics) are covered in detail. Along with the reduction in weight and overall dimensions, micromodular circuits substantially improve the reliability of the equipment due to the mechanization and automation of the production of these units and blocks, the reduction in the number of soldered joints, the application of complete hermetic sealing, and the possibility of total or individual replacement of units, blocks, or entire devices. (Author)