R and D of the Technologies Required to Design and Fabricate Ultrahigh-Speed Computer Systems

摘要

A research and development program was directed toward the development of fabrication technologies for high-speed computer subsystems. High-yield technologies for fabricating high-speed, high-density microcircuit and two-level microcircuit array structures have been developed and demonstrated. Design requirements for small-geometry three-level arrays have also been established. Multichip high-speed LSI subsystems have been assembled by face-down bonding, and characterized for speed and thermal properties. Computer aid has been incorporated into a system for designing and generating photomasks for complex high-speed microcircuits. A simple high-speed ECL gate and a complex, high-speed, high-density transistor Read-Only Memory were successfully designed and fabricated to demonstrate the technique. (Author)