Exploratory Development Study Microelectronics UHF Power Assembly

摘要

The report identifies possible future microelectronic development tasks which will lead to a more optimum RF power assembly which is compatible with monolithic fabrication techniques. Component, circuit technique, mechanical and thermal transfer design requirements are identified which contribute to achieving a small UHF transceiver of 100 to 1000 watts CN in the 225-400 MHz range which is contained in a 40 cu. in. volume. (Author)