Procurement of Reliable Semiconductor Devices for Military Space Applications

摘要

A study was undertaken to determine the feasibility of obtaining high reliability devices for long term space missions and military applications by imposing and monitoring additional process quality controls and screening procedures on standard commercial production lines. A survey of more than a dozen semiconductor manufacturers indicated that the following reliability areas are not adequately controlled: metallization, wire bonding, loose conductive particles and ceramic packages sealed by low melting point glasses. Wide variations were found in the manner in which the bond strength test is carried out. Methods were studied to institute SEM inspection and a more rigorous bond strength test on the production lines, coupled with wafer and bonder traceability. This report surveys reliability problems caused by defects in semiconductor devices and their control. (Author)