Manufacturing Methods Applicable to Memory System for Microcircuits.

摘要

Efforts to establish manufacturing methods for producing a compact,low power,modular memory system are described. The memory uses vacuum deposited MATED FILM storage elements,vacuum evaporated wiring and insulation,integrated circuits ultrasonically face-down bonded to evaporated wiring,and reflow soldered and/or welded copper-Mylar interconnections. The design,fabrication,and test of the memory system is reported. The equipment and methods used for MATED FILM deposition,vacuum evaporation,integrated circuit test,face-down bonding,and copper-Mylar reflow soldering and/or welding are described. (Author)