Metastable Grain Boundary Segregation in Copper Containing Tellurium.

摘要

Evidence for metastable grain boundary segregation has been experimentally obtained in Cu alloyed with 25 to 100 ppm Te. The solution-treated material fractured in a ductile intergranular mode. After aging for a short time; i.e., one day at 540C, the fracture is intergranular and is attributed to the observed integranular segregation of Te. The magnitude of the tellurium segregation and its local nature are established using Auger electron spectroscopy. Further aging results in precipitation of a stable phase throughout the grains and grain boundary fracture no longer takes place. (Author)