Surface Temperature Indicators as a Practical Means of Fault Isolation in Electronic Equipment.

摘要

The report proposes and analyzes a new method of reducing fault isolation times;fault isolation using surface temperature indicators. For less than 0.2cents per component,each component in an electronic system can be coated with a surface temperature indicator which will melt or change color when the component is overstressed or when the failure rate of that component exceeds a predetermined limit. (Modified author abstract)