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PRINTED CIRCUIT BOARD OUTLINES AND ELECTRONIC PACKAGE MECHANICAL DRAWINGS

机译：印刷电路板外形和电子封装机械图

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摘要

Complete mechanical drawings regarding the manufacture of components and assembly specifications for the macromodular electronic cases and printed circuit board routing dimensions for macromodular electronic assemblies are given. (Author)

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作者
Robert J. Arnzen;
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年度 1974
页码 1-84
总页数 84
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Central processing units; Modules(Electronics); Logic devices; Printed circuits; Mechanical drawings; Logic design; Macromodules;

机译：中央处理单元;模块（电子）;逻辑器件;印刷电路;机械图纸;逻辑设计;宏模块;

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专利

1. Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints [J] . Wu PL, Huang MK, Lee C, Journal of the Chinese Institute of Chemical Engineers . 2004,第5期

机译：印刷电路板表面光洁度和热机械疲劳度对小轮廓J引线/ Sn-X（X = AgCu和Pb）焊点的组织和机械强度的影响
2. Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards [J] . John H. Lau, M. S.Zhang, S. W. Ricky Lee Journal of Electronic Packaging . 2011,第3期

机译：具有硅通孔的嵌入式三维混合集成电路集成系统级封装，用于有机基板/印刷电路板中的光电互连
3. Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane [J] . Leung Tsang, Miller D. IEEE Transactions on Advanced Packaging . 2003,第4期

机译：电子封装和印刷电路板结构中通孔的耦合，接地平面有限
4. Modeling multilayer power/ground planes in printed circuit boards and electronic packages using microwave networks [C] . Zhang W.Z., Liu E.X., Li E.P. 2012 IEEE 14th Electronics Packaging Technology Conference . 2012

机译：使用微波网络对印刷电路板和电子封装中的多层电源/接地平面建模
5. Board level flexural reliability testing and failure analysis of custom printed circuit boards with WCSP packages. [D] . Shinde, Guruprasad Shrikant. 2016

机译：带有WCSP封装的定制印刷电路板的板级抗弯可靠性测试和故障分析。
6. Highly Integrated Elastic Island-Structured Printed Circuit Board with Controlled Young’s Modulus for Stretchable Electronics [O] . Duho Cho, Junhyung Kim, Pyoenggeun Jeong, 2020

机译：高度可控的弹性岛结构印刷电路板具有可控制杨氏模量的可拉伸电子产品
7. Macromodular Computer Design, Part 2, Volume 06, Printed Circuit Board Outlines and Electronic Package Mechanical Drawings [O] . Computer Systems Laboratory Washington University 1974

机译：宏模块计算机设计，第2部分，第06卷，印刷电路板轮廓和电子封装机械图
8. Designing an Electronics Data Package for Printed Circuit Boards (PCBs). [R] . Ryan, D. V., Brown, A. S. 2013

机译：为印刷电路板（pCB）设计电子数据包。

PRINTED CIRCUIT BOARD OUTLINES AND ELECTRONIC PACKAGE MECHANICAL DRAWINGS

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