Exploratory Development of Processable Laminating Resins With Improved Toughness and Moderate Temperature Capability - Phase II and III.

摘要

A new polyimide resin is developed that provides processing characteristics and basic mechanical properties equivalent to those of commercially available high performance epoxy resins. This new resin, DONA polyimide resin, provides high resistance to moisture thus overcoming a major problem associated with the high performance epoxy resins. An alternative polyimide resin, DAS polyimide resin, is also identified but not developed to the same level as the DONA resin. Fracture toughness studies are performed on DONA/A-S GRAPHITE FIBER COMPOSITES AND COMPARISONS ARE DRAWN WITH EPOXY/A-S graphite fiber composites. Strength retention at 365 F of these composites is equivalent to that of high performance epoxy systems. (Author-PL)