Review of High-Reliability Procurement Practices in the Semiconductor Industry.

摘要

High-reliability procurement practices in the semiconductor industry have been reviewed in the light of Lincoln Laboratory experience over the past two years. The merits and drawbacks of different types of product assurance methods and specification systems are described. A different kind of procurement method is proposed,in which devices are obtained from the vendors in wafer form on the basis of stringent wafer acceptance tests and subsequently processed on a controlled line under strict quality control conditions including in-process quality control tests,positive lot control and exhaustive screens. (Author)