Component Damage from Electromagnetic Pulse (EMP) Induced Transients.

摘要

The Lance Vulnerability and Hardening Test Program was supported by a number of in-laboratory experiments on various component types. Of prime concern was the establishment of component EMP thresholds to be used in establishing the vulnerability level of the system. Reported are pulsed transient tests on over 50 component types. Testing concentrated on sensitive semiconductor components, and about 1800 individual devices were damage tested. The tests used rectangular pulses varying in width from 5 ns to 30 micros. Numerous nonsemiconductor components also were characterized. (Author)