Cure Monitoring Techniques for Adhesive Bonding Processes.

摘要

Dielectric monitoring was successfully applied to the adhesive bonding process for structural aerospace adhesives. Of the three methods investigated, the one best suited for production applications was demonstrated for flat adherends of various substrates and aluminum honeycomb panels. A monitoring technique which uses a foil probe embedded in the bondline permits multipoint cure monitoring in a single bondline. Effects of the probe on bondline strength were determined.