Molecular Structure and Cohesive Properties of Polymeric Adhesives.

摘要

The objective of the program was to develop quantitative relationships between molecular structure and cohesive strength properties of modified epoxy adhesives. Two commercial adhesives, a nylon-epxoy resin and a rubber-epoxy resin, were characterized and quantitatively analyzed. Model compositions were prepared in the laboratory equivalent to these two commercial materials. The rheological behavior as a function of curing conditions was characterized by torsional braid analysis. Results showed that at fixed composition the glass transition of the epoxy varied from 110 C to 140 C depending on cure history. The compatibility of the main components of the rubber modified the model adhesive versus compostion and temperature was determined by cloud point measurements. The observed morphology of cured CTBN modified epoxy resins was consistent with the miscibility diagram. (Author)