A Laser Defect Repair System for SAW Devices.

摘要

A laser system has been designed and built for the repair of defects in SAW devices. The system employs a precisely-focused beam from a frequency-doubled Nd:YAG laser to machine metallic material on or near the interdigital fingers of SAW devices,thereby removing 'shorted'electrodes. The study and design concentrated on the ability to machine submicrometer-sized holes by melting of the metal conductors without damaging the crystalline substrate. It was found that this was best accomplished using the 0.53micrometer radiation of a doubled-Nd:YAG laser,expanded to provide nearly-uniform illumination of a high numerical-aperture focusing objective. Effort was also expended on optimizing the device handling,viewing and positioning system to permit accurate machining of these small areas. The results obtained demonstrated that repairs could be successfully made without apparent damage to the SAW devices. (Author)