Semi-Additive Processes for Fabrication of Printed Wiring Boards

摘要

Printed wiring boards fabricated by semi-additive processes from four laminate types have met the requirements of MIL-P-13949, MIL-P-5110, and selected tests of MIL-P-55640. Laminate types consisted of ultra-thin copper with peelable carrier, ultra-thin copper with etchable carrier, sacrificial foil, and adhesively-coated nonclad. (Author)