Manufacturing Methods and Technology Program Automatic In-Process Microcircuit Evaluation

摘要

This final report summarizes all the work performed under the subject contract. The method of approach to the program included system analyses to investigate techniques for hybrid image extraction, determination of illumination requirements and techniques, and determination of Return Beam Vidicon operating modes for the demonstration model. An AIME demonstration model and system software were designed, built, integrated and tested. Technical and physical descriptions of the demonstration model equipment/software design and configuration are provided. Analysis was made of typical characteristics of hybrid thick-film substrate conductor faults resulting from printing, probing and work-in-process handling. Based on this analysis test sample substrates containing designed-in-faults were designed, fabricated and used to evaluate AIME demonstration model operation. Data resulting from AIME operation, utilizing the test sample substrates, demonstrated automatic detection of 96.4 percent of all substrate defects. When defects were classified by size, AIME successfully detected 100 percent of defects three (3) mils or larger, and 81 percent of defects less than three (3) mils. Evaluation was also made of semi-automatic mode of operation for pre-cap hybrid visual inspection. Recommendations for further system development are included. (Author)