A Chemical Milling Method of Producing Thin Walled Waveguide Thermal Isolating Sections

摘要

This report outlines a chemical milling process by which the wall thickness of copper waveguide sections can be reduced to 0.10 mm (0.004 ins). The process permits flange machining and lapping of the relevant component to be completed prior to the reduction of the wall thickness, thereby eliminating the possibility of damage to the fragile section during these operations. (Author)