Development of Hot Melt Flexible Polyimide Sealants for Rapid Sealing of Aircraft and Missiles.

摘要

Studies were conducted on a baseline hot-melt flexible polyimide formulation developed on a previous NADC contract for potential application as a quick-fix field repair sealant for Navy aircraft and missiles. The baseline formulation was 1.0:0.5:0.6 by mol methylenedianiline (MDA) :bismaleimidophenylmethane (BMPM) :Jeffamine ED-900 bismaleimide (BMJ900). Studies consisted of Task I - Flexible Polyimide Optimization Scale-up - and Task II - Resin Compounding Hot Melt Tool Development - and III - Finalize Sealant Evaluation Studies. Different variations of filled and compounded formulations were prepared and examined for solvent, water immersion, and humidity stability. Efforts were conducted to prepare a formulation suitable for extrusion through a commercially available hot-melt sealant applicator. No one resin was found to meet the program goal requirements. Because of this, Task IV - Field Demonstration - was not performed, with concurrence of the NADC Technical Monitor.