Replacement of Precious Metal Thick Film Inks Using Conductive Polymer Technology

摘要

Thick film hybrid electronics using precious metals such as gold, silver, and the platinum group are in integral part of the processing of most electronic components. The high intrinsic cost and strategic nature of these materials present natural motivation for investigation into alternative technologies that could reduce or eliminate them. The purpose of this work was to evaluate the feasibility of incorporating current and future synthetic metals into thick film technology for electronic and aerospace applications. The work carried out in this study included a literature review to identify available potential synthetic metal candidates. This included discussions with researchers active in this program. Herein is a brief discussion of thick film technology and the potential utilization of synthetic metals. Also included are preliminary test results on several prototype synthetic metal thick film materials. Evaluations were carried out based on conductivity, short-term stability, adhesion, and tractability. Initial observations indicate may technical obstacles to practicality. However, the overall results were considered encouraging, and sufficient feasibility was demonstrated to warrant further study.