Thermal and Thermal Stress Analyses in Substrates during Coating Deposition

摘要

Thermal deflection of a cantilever substrate and a circular wafer during and after thin film deposition is analyzed. Simple and accurate expressions for the substrate temperature are obtained under the assumption of constant heat flux at the front surface and heat dissipation according to Newton's law at the rear surface during deposition and heat dissipation at both surfaces after deposition. The solution is then applied to extract, from published measured total deflection-history data, the deflection history of the substrate due to intrinsic stress only.