Moisture Migration during Bonded Repair of Wet Composite.

摘要

Methods of estimating the moisture profile in composites during drying and subsequent bonded repair have been reviewed. A new method with rapid estimation of drying time based on literature values for the diffusion constant has been proposed. Methods of controlling void formation during bonding have been studied and difficulties in using standard repair techniques have been highlighted. New criteria for selection of repair adhesives to minimize void formation are proposed. (RRH)