Industrial Technology Modernization. Pick and Place Assembly Machine. Project 1. Phase 2

摘要

Both leaded and leadless surface-mount components will be automatically placed on Printed Wiring Boards (PWBs). A pattern recognition vision system will identify circuit board positions and feed offset information to the host microprocessor. A pick and place machine will be programmed to interface with the microprocessor and individually mount prepared parts to the board surface. Automatic pick and place machinery, Automatic component mounting, Electronics. (jes)