Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials

摘要

A fundamental program of research on the mechanical properties of microelectronic thin film materials is underway at Stanford University. The work is being supported under AFOSR Grant No. 86-0051. In this interim Scientific Report, some of the progress made during the second year of the program is reviewed. We have made rapid progress since starting this development of new experimental techniques for measuring mechanical properties of thin films. That work led to several publications and to an equal number of invited oral presentations, both of which are listed at the end of this report. Now much of our work involves the use of these techniques to study mechanical properties of thin film materials of interest in microelectronics.