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Water Disbondment Characterization of Organic Coating/Metal Substrate Systems

机译:有机涂层/金属基体系统的水分离表征

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The adhesion of many organic coatings to metal substrates is adversely affected by exposure to an aqueous environment. Even high relative humidities can cause coating disbondment to occur. The mechanism behind this adhesion loss is the accumulation of water molecules at small preexisting unbonded areas at the coating under a concentration gradient, condenses in these areas and causes them to grow. As these areas grow laterally, they cause stresses to occur at the coating/substrate interface which eventually leads to the specific coating makes with the substrate the more resistant that system is to water disbondment.

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