Via-Slot Coupling of Shielded Microstrip Lines.

摘要

Solution of complicated boundary value problems in the spectral domain is a very well known technique. Several years ago Itoh and Mittra used spectral analysis to solve planar geometry problems occurring in microwave integrated circuits. There have been numerous papers subsequently published utilizing this method. In this paper, Fourier analysis is used to formulate the solution for reflected and transmitted surface current densities in back to back shielded microstrip structures coupled by a transverse slot in their common wall. By applying Galerkin's procedure in the spectral domain on complementary field quantities, a solvable system of equations containing the desired reflection and transmission coefficient results. (r.h.)