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Advanced Study of Natural Convection Immersion Cooling of a 3 x 3 Array of Simulated Components in an Enclosure Filled with Dielectric Liquid

机译:在介电液体填充的外壳中自然对流浸没冷却3×3阵列模拟元件的先进研究

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An experimental study has been conducted to examine the three dimensional natural convection heat transfer from an array of simulated electronic components immersed in a chamber filled with Fluorinert FC-75, a commercially available dielectric liquid. The top and bottom walls of the chamber were maintained at uniform temperature while all other surfaces were insulated. The simulated components were in the form of a 3 x 3 array of discrete protruding aluminum blocks, each with geometrical dimensions of a 20 Pin Dual-inline-Package. The components were electrically powered resulting in a range of energy dissipation levels from 0.1 to 3.1 watts. Flow visualization in steady state was accomplished using Magnesium particles illuminated by a Helium Neon laser plane. Component surface temperature measurements allowed determination of the heat transfer characteristics. Timewise fluctuations of temperature at several locations were measured with increasing power levels. Keywords: Computer programs, Electronic cooling, Protruding heat sources, Flow visualization, Convective heat transfer, Immersion cooling, Dielectric liquids, Theses. (jhd)

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