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Study of Hydrogen Permeation through Metals and Feasibility of Using CryogenicHydrogen in Microchannel Cooling of High-Power Electronics

机译：金属氢渗透及大功率电子微通道冷却中使用低温氢气的可行性研究

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年度 1990
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总页数 16
原文格式 PDF
正文语种 eng
中图分类工业技术;
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Bioacoustics; Deafness; Background; Noise; Symposia; Earphones;

机译：生物声学;耳聋;背景;噪声;专题讨论会;耳机;

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2. Experimental study on cooling of high-power laser diode arrays using hybrid microchannel and slot jet array heat sink [J] . Deng Zeng, Shen Jun, Dai Wei, Applied thermal engineering: Design, processes, equipment, economics . 2019,第期

机译：使用混合微通道和槽射流阵列散热器冷却大功率激光二极管阵列的实验研究
3. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (～1 kW/cm~2) Power Electronics Cooling [J] . Kl Wook Jung, Sougata Hazra, Heungdong Kwon, Journal of Electronic Packaging . 2020,第3期

机译：用于硅基嵌入式微通道 - 三维歧管冷却器的热和制造设计考虑部分 - 第2部分：高热通量EMMC的参数研究（〜1 kW / cm〜2）电力电子冷却
4. CALCULATION MODEL OF HYDROGEN PERMEATION IN COPPER COOLING STAVE AND EXPLORATORY RESEARCH ON PREPARATION OF HYDROGEN PERMEATION BARRIER [C] . Feng-guang Li, Rui Guo, Si-you Ye, Materials Science amp;amp;amp; Technology Conference and Exhibition . 2019

机译：铜冷却梯级氢渗透的计算模型及氢渗透屏障制备的探索性研究
5. Numerical study of pressure-driven nitrogen flow in long microchannels for application to electronic cooling [D] . Sun, Zhanyu 2009

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6. Swing-like pool boiling on nano-textured surfaces for microgravity applications related to cooling of high-power microelectronics [O] . Sumit Sinha-Ray, Wenshuo Zhang, Barak Stoltz, 2017

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7. Use of Orthogonal Array to Study the Effect of Various Parameters on Liquid Metal based Microchannel Cooling [O] . Deewakar Sharma, Harry Garg, P. P. Bajpai 2012

机译：用正交阵列研究各种参数对液态金属微通道冷却的影响
8. Feasibility Study of a Cryogenically Cooled Window for High-Power Gyrotrons [R] . Haste, G. R., Kimrey, H. D., Prosise, J. D. 1986

机译：大功率陀螺仪低温冷却窗的可行性研究

Study of Hydrogen Permeation through Metals and Feasibility of Using CryogenicHydrogen in Microchannel Cooling of High-Power Electronics

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