Stereo Laser Micromachining of Silicon. (Reannouncement with New AvailabilityInformation)

摘要

A technique has been developed for 1-micron m resolution, high speedmicromachining of three-dimensional (3D) silicon parts. The method, based on acousto-optic deflection of laser microchemical chlorine etching reactions, creates parts directly from a file generated with computer-aided design/computer-aided manufacturing (CAD/CAM) software. In this demonstration, 1-micron m(3) pixels are removed at a rate of 2 X 10(4) pixels/s. The laser-driven process relies on one of the fastest-known sustained gas/solid interface reactions, and