Shipping containers; Hazardous materials; Boxes; Wood; Projectiles; Test and evaluation; Stacking; Vibration; Drop tests; Performance oriented packaging;
机译:进入电气测试之前,AOI和X射线系统会检查装有高级封装的高密度PCB的组装故障。
机译:合金组合与PCB位置对包装包装(POP)组装滴测试的影响
机译:空间碎片保护屏蔽的形状电荷测试和各种射弹形状的性能评估。