Smart Spatial Light Modulator Research and Development

摘要

The objective of this research was to demonstrate smart spatial light modulators(S-SLM's) or smart pixels where electronic circuits are combined with optoelectronic components (i.e, lasers, modulators, and detectors). S-SLM's are the key components for high-speed, massively-parallel optical and optoelectronic interconnects and computing systems. The integration of mature electronic and optoelectronic components allows electronic processing elements to enhance their performance to levels not achievable by pure electronic implementation. During the duration of the project, we devoted our efforts in developing scalable fabrication technologies that allow integration of ferroelectric ceramic and semiconductors (Si, GaAs); technologies developed and implemented were direct-bonding and low-temperature flip-chip bonding. We also evaluated the performance potential of ferroelectric thin film multilayer-based light modulator and electrically tunable wavelength filter. The direct bonded technology that we developed is simpler and much more scalable than previous epitaxial liftoff (ELO) and bonding technologies. We have successfully combined direct bonding and flip-chip bonding technologies to realize functional smart pixel structures consisting