Semiconductor Packaging: A DoD Dual Use Technology Assessment

摘要

This assessment concludes that commercial capabilities for single-chipsemiconductor packaging are sufficient to assure affordable access to meet military needs, and no action is required by the Department of Defense (DoD). Driven by markets in telecommunications, computers, consumer electronics, and automotive systems, the integrated circuit (IC) packaging industry is able to provide the mainstream packaging technology required by the DoD. Although predominantly offshore, IC assemblers and equipment suppliers are highly competitive and diversified. Packaging materials suppliers are concentrated in Japan, but there has been no indication that access to materials will be limited or denied.