Chip on Glass Technology for Flat Panel Displays

摘要

The goal of this contract was to apply chip on glass wire bonding and connectiontechniques to flat panel displays. This would considerably lower the cost of completed panels by eliminating individual driver chip packaging and as many as 3000 connections for a 640 x 480 pixel display. In addition, there would be benefits in size and reliability. The effort was able to successfully demonstrate that the process could be compatible with the structure and materials present in a flat panel display. A number of displays were fabricated and tested. The reliability of the drive chips proved to be a limiting factor, due to insufficient testing before installation. At present it is cost effective for displays smaller than 640 x 480; however, as the quality of the chips increases, it is expected to become cost effective to use the techniques developed in this program for larger displays.