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Characterization of Porosity Distributions of Slurry-Coated and Dry-PowderPlaques Using Conductive Image Technique

机译:用导电图像技术表征浆料涂层和干粉饼的孔隙度分布

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The porosity distributions of sinter plaques manufactured by dry powder and wetslurry processes were measured using an improved conductive imaging microprobe. This study has indicated that the pore size distributions of dry-powder plaques are more uniform than those of the slurry-coated plaques. For the slurry process, porosity distribution depends on many variables (such as slurry viscosity and density, sinter temperature, and processing speed), and the pore size distribution can have significant spatial variability if the sintering conditions deviate significantly from the optimum. The results also suggest that for wet-slurry sinter, better process optimization could be obtained by properly controlling the above-mentioned parameters to obtain more uniform and reproducible slurry coats. (MM).

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