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Evolution of the microstructure during high-temperature creep and oxygenation in directionally solidified YBa2Cu3O7-x

机译:YBa2Cu3O7-x定向凝固过程中高温蠕变和氧合作用时微观组织的演变

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The microstructure of YBa2Cu3O7-x-Y2BaCuO5 melt-textured composities deformed in the secondary and tertiary creep regimes has been investigated by transmission electron microscopy. The high density of Y2BaCuO5 precipitates plays an important role in the microstructural development as pinning sites for gliding dislocations. In the secondary regime, trapped dislocations are dissociated, leaving a stacking fault with displacement vector [1/2 - delta 0 1/3]. second stacking fault, 1/6 [301] is typically associated with the former stacking fault. At this stage, the deformation microstructure is dominated by diffusive processes between precipitates interconnected by the trapped dislocations. In the tertiary stage, dislocation multiplication is the main factor controlling the microstructure. which is characterized by a dramatic increase in the density of perfect dislocations with Burgers vectors [100] and [110]. Since deformation is performed above the orthohombic-to-tetragonal transition temperature, the samples need to be oxygenated in order to achieve the superconducting phase. We have found that this oxygenation step, performed at 450 degrees C, induces severe modifications of the as-deformed microstructure.
机译:通过透射电子显微镜研究了在二次蠕变和三次蠕变状态下变形的YBa2Cu3O7-x-Y2BaCuO5熔体组织的微观结构。 Y2BaCuO5沉淀物的高密度在微观结构发展中起重要作用,作为滑移位错的固定位点。在次要状态下,被捕获的位错被解离,留下具有位移矢量[1/2-delta 0 1/3]的堆积缺陷。第二个堆叠故障,1/6 [301]通常与前一个堆叠故障相关。在这一阶段,形变的微观结构主要由被位错相互连接的析出物之间的扩散过程所控制。在第三阶段,位错倍增是控制微观结构的主要因素。其特征是汉堡向量[100]和[110]显着提高了位错的密度。由于变形是在正交或四方转变温度以上进行的,因此需要对样品进行氧化,以实现超导相。我们已经发现,在450℃下进行的该氧合步骤引起变形后的微观结构的严重改变。

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