Mechanical properties of extruded Bi_(85)Sb_(15) alloy prepared by mechanical alloying

摘要

The mechanical properties of the Bi_(85)Sb_(15) thermoelectric alloy prepared by mechanical alloying and consolidated by hot extrusion have been investigated at 77 and 300 K. A three-point bending test was used in the course of this analysis because the stress state of sample in bending is similar to the distribution of stresses in a thermocouple of a Peltier cooling device. The modulus of rupture of the polycrystalline samples is roughly the same at the two studied temperatures with a value of about 100 MPa. This value is about ten times that obtained for Bi_(85)Sb_(15) single crystals prepared by the Czochralski method.