DuPont has been expressing keen interest toward the development of semiconductor packaging technologies and in alignment to that interest, DuPont Wafer Level Packaging Solutions, part of DuPont Electronic Technologies, has signed a joint-development agreement with Nippon Kayaku Co. Ltd. (NKC) and its wholly owned subsidiary, MicroChem Corp. to develop electronic materials. Wafer level packaging refers to the technology of packaging an integrated circuit at wafer level, instead of the traditional process of assembling the package of each individual unit after wafer dicing.
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