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Effect of Ni content on the microstructure and electrochemical properties of Ni-SDC anodes for IT-SOFC

机译:镍含量对IT-SOFC用Ni-SDC阳极组织和电化学性能的影响

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摘要

Ni-SDC (samaria-doped ceria) films for an IT-SOFC anode were fabricated by a slurry spin coating method. The microstructure and electrochemical performances of the Ni-SDC anodes were investigated with respect to the Ni vol.%. The connectivity of Ni-Ni grains, SDC-SDC grains and Ni-SDC grains, which is remarkably influenced by the Ni vol.%, is suggested to dominate the electrochemical behavior of the Ni-SDC anodes, including a hydrogen adsorption/diffusion process on the surface of Ni particles and a charge transfer process on the SDC electrolyte. A porous microstructure consisting of homogeneously distributed Ni and SDC phases together with well-connected grains was observed for the Ni-SDC anodes containing 50% and 60% volume content of Ni, which exhibited a polarization resistance around 0.1 Ω cm~2 together with an overpotential around 30 mV under a current density of 200 mA cm~(-2) at 800 °C in a 60%N_2 + 40%H_2 atmosphere.
机译:通过浆料旋涂法制备了用于IT-SOFC阳极的Ni-SDC(掺杂氧化铈的二氧化铈)膜。关于Ni-vol%,研究了Ni-SDC阳极的微观结构和电化学性能。 Ni-Ni晶粒,SDC-SDC晶粒和Ni-SDC晶粒之间的连接性受Ni vol。%的显着影响,建议其主导Ni-SDC阳极的电化学行为,包括氢吸附/扩散过程Ni颗粒表面的电荷转移和SDC电解质上的电荷转移过程。对于包含50%和60%体积百分比的Ni的Ni-SDC阳极,观察到由均匀分布的Ni和SDC相以及良好连接的晶粒组成的多孔微结构,其极化电阻约为0.1Ωcm〜2在60%N_2 + 40%H_2气氛中,在800 mA的电流密度下,在800°C的电流下,约30 mV的超电势。

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