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Thermal Conductivity of Pressureless Sintered Silicon Nitride Material with LiYO_2 Additive

机译:含LiYO_2添加剂的无压烧结氮化硅材料的导热系数

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Si_3N_4 ceramics with different microstructures were prepared by pressureless sintering, using LiYO_2 as a sintering additive. The effect of microstructural parameters, such as grain size and volume of intergranular phase on thermal conductivity was studied. Materials with thermal conductivities of 26-38 W centre dot (m centre dot K~(-1)) were obtained by changing the amount of sintering additive. The highest conductivity was measured for the material with the least amount of additive. Since the phase composition is the same for all sintered materials the difference in thermal conductivity is attributed to the amount of glassy phase in the grain-junctions.
机译:以LiYO_2为烧结助剂,通过无压烧结制备出不同结构的Si_3N_4陶瓷。研究了晶粒尺寸和晶间相体积等微观结构参数对导热系数的影响。通过改变烧结助剂的用量,可获得导热率为26-38 W中心点(m中心点K〜(-1))的材料。对于添加量最少的材料,测得的导电率最高。由于所有烧结材料的相组成均相同,因此热导率的差异归因于晶粒结中的玻璃相数量。

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