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A simple method for calculation of the pull-in voltage and touch-point pressure for the small deflection of square diaphragm in MEMS

机译:MEMS中方形膜片小挠度的引入电压和接触点压力的简单计算方法

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摘要

There are a number of MEMS structures that make use of diaphragms. The deformation of the diaphragm for the purpose of actuation and transduction can be brought about by application of voltage and/or pressure or any other mechanical excitation like acceleration, force, etc. The amount of deformation can be measured by changes in the capacitance between the diaphragm and the fixed electrode. The gap between the electrodes can be an air gap or can have an intervening layer of the dielectric on the fixed electrode along with the air gap. The pull-in voltage and touch-point pressure along with the structural and material properties are critical parameters that decide the behavior of the actuator/transducer. This paper presents a simple methodology, which is capable of representing small deflection of diaphragm with pressure, and/or applied voltage. The method proposed is less complex and less time consuming in comparison with FEM tools. Closed form expressions have been derived for pull-in voltage with/without dielectric between the two electrodes and critical distance for pull-in. The closed form expressions for touch-point pressure have also been derived. The results are compared with those obtained by simulation as well as experiment. (C) 2007 Elsevier B.V. All rights reserved.
机译:有许多利用膜片的MEMS结构。通过施加电压和/或压力或任何其他机械激励(如加速度,力等),可以引起用于致动和换能的隔膜变形。隔膜和固定电极。电极之间的间隙可以是空气间隙,或者可以与空气间隙一起在固定电极上具有介电层的中间层。引入电压和接触点压力以及结构和材料特性是决定执行器/传感器性能的关键参数。本文提出了一种简单的方法,该方法能够表示隔膜在压力和/或施加电压下的较小偏转。与FEM工具相比,所提出的方法不那么复杂,而且耗时更少。对于在两个电极之间具有/不具有电介质的引入电压以及引入的临界距离,已经得出了闭合形​​式的表达式。还得出了接触点压力的闭合形式。将结果与通过仿真和实验获得的结果进行比较。 (C)2007 Elsevier B.V.保留所有权利。

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