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Deformation and fracture in micro-tensile tests of freestanding electrodeposited nickel thin films

机译:独立式电沉积镍薄膜的微拉伸试验中的变形和断裂

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摘要

In situ scanning electron microscopy micro-tensile tests were conducted on freestanding LIGA nickel thin films of two thicknesses (70 and 270 mu m). The deformation and fracture mechanisms were elucidated by in situ scanning electron microscopy imaging and ex situ fractographic analysis. Due to the film microstructural gradient, an apparent thickness effect on the film yield strengths was observed, which was then rationalized with a continuum micromechanics model.
机译:对两种厚度(70和270μm)的独立式LIGA镍薄膜进行了原位扫描电子显微镜微拉伸试验。通过原位扫描电子显微镜成像和非原位形貌分析,阐明了变形和断裂机理。由于薄膜的微观结构梯度,观察到了明显的厚度变化对薄膜屈服强度的影响,然后用连续微力学模型对其进行了合理化。

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