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首页> 外文期刊>New Journal of Chemistry >Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications
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Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

机译:开发用于微电子应用的无卤阻燃剂磷腈和稻壳灰混合苯并恶嗪共混环氧复合材料

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摘要

The present study is focused on the synthesis and characterization of flame retardant amine-terminated cyclophosphazene and silane functionalized rice husk ash reinforced benzoxazine blended epoxy composites as a halogen-free flame retardant material (ATCP/FRHA/Bz-Ep). FT-IR spectroscopy, scanning electron microscopy (SEM), X-ray diffraction analysis, contact angle measurements, dielectric constant, DSC, TGA, UL-94, LOI and cone calorimetry were used to characterize the surface morphology as well as the structural, electrical, thermal and flame retardant properties of the resultant ATCP/FRHA/Bz-Ep composite material. The experimental results suggested that ATCP/FRHA/Bz-Ep composites exhibit better flame retardant and dielectric performance compared to that of a neat Bz-Ep material. A plausible mechanism of the fire retardant ATCP/FRHA/Bz-Ep composite material is hypothesized based on the results of cone calorimetric, thermal and electrical analysis. From the abovementioned results, it was concluded that the ATCP/FRHA/Bz-Ep composite can be used as an electrical resistant material for electronic and microelectronic applications.
机译:本研究的重点是作为无卤阻燃材料(ATCP / FRHA / Bz-Ep)的阻燃胺封端的环磷腈和硅烷官能化的稻壳灰增强苯并恶嗪共混环氧复合材料的合成和表征。 FT-IR光谱,扫描电子显微镜(SEM),X射线衍射分析,接触角测量,介电常数,DSC,TGA,UL-94,LOI和锥形量热法用于表征表面形态和结构,所得ATCP / FRHA / Bz-Ep复合材料的电,热和阻燃性能。实验结果表明,与纯Bz-Ep材料相比,ATCP / FRHA / Bz-Ep复合材料具有更好的阻燃性和介电性能。根据锥量热,热和电分析结果,推测了阻燃ATCP / FRHA / Bz-Ep复合材料的合理机理。从上述结果可以得出结论,ATCP / FRHA / Bz-Ep复合材料可用作电子和微电子应用的电阻材料。

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