Accurate Modeling of Multilayer Transmission Lines for High-Speed Digital Interconnects

摘要

In this paper, we consider the finite element modeling of multilayer transmission lines for high-speed digital interconnects. We mainly focused on the modeling of the transmission structures with both cases of symmetric and asymmetric geometries. We specifically designed asymmetric coupled microstrips and four-line symmetric coupled microstrips with a two-layer substrate. We computed the capacitance matrix for asymmetric coupled microstrips and the capacitance, and inductance matrices for four-line symmetric coupled microstrips on a twolayer substrate. We also provide the potential distribution spectrums of the models.