Temperature Distribution inside Layer of Powder Material in Electrical Contact Covering

Pak Won Gun; Pak Si Won

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Temperature Distribution inside Layer of Powder Material in Electrical Contact Covering

机译：电触头覆盖层中粉末材料层内部的温度分布

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We make up a heat conductivity model inside the layer of powder material in the electrical contact covering.

机译：我们在电触点覆盖层的粉末材料层内部建立一个导热模型。

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《Kumsok》 |2005年第1期|共3页
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Pak Won Gun; Pak Si Won;
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正文语种 kor
中图分类金属学与金属工艺;
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专利

1. Temperature Distribution inside Layer of Powder Material in Electrical Contact Covering [J] . Pak Won Gun, Pak Si Won Kumsok . 2005,第1期

机译：电触头覆盖层中粉末材料层内部的温度分布
2. Production technology, structure and properties of Cu-W layered composite condensed materials for electrical contacts [J] . V.V. Bukhanovsky, N.I. Grechanyuk, R.V. Minakova International Journal of Refractory Metals & Hard Materials . 2011,第5期

机译：电触头Cu-W层状复合冷凝材料的生产工艺，结构和性能
3. Microlayered Composite Materials on Basis of Copper, Refractory, Rare-Earth Metals, and Carbon for Electrical Contacts and Electrodes [J] . Victor Volodymyrovych Bukhanovsky, Mykola Petrovych Rudnytsky, Ilija Mamuzich International Journal of Nonferrous Metallurgy . 2014,第2期

机译：用于电触点和电极的基于铜，耐火材料，稀土金属和碳的微层复合材料
4. Effect of the sublayer material on the formation of electrical contact and the growth rate of carbon nanotubes in a low-temperature plasma using the example of Ni/Ti/Si and Fe/W/Si structures [C] . Viktor S. Klimin, Alexey A. Rezvan, Oleg A. Ageev International Conference on Micro- and Nano-Electronics . 2019

机译：使用Ni / Ti / Si和Fe / W / Si结构的实施例，子层材料在低温等离子体中形成电接触和碳纳米管生长速率的影响
5. Synthesis and characterization of powder metallurgical silver-graphite electrical contact materials [D] . Rehani, Bharati Rajeev. 2009

机译：粉末冶金银石墨电触头材料的合成与表征
6. Effect of Temperature Distribution in Ultrasonically Welded Joints of Copper Wire and Sheet Used for Electrical Contacts [O] . Jeyaraj Pradeep Kumar 2018

机译：温度分布对电触点用铜线和板的超声焊接接头的影响
7. TEMPERATURE DISTRIBUTION DURING POWDER COATINGS APPLYING USING PLASMA STREAM WITHIN THEIR CONTACT WITH THE SUBSTRATE LAYER [O] . A.A. Khafizov, Yu.I. Shakirov, S.N. Timergaliev, 2015

机译：在与基底层接触的粉末涂层期间施用温度分布

Temperature Distribution inside Layer of Powder Material in Electrical Contact Covering

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